SSU-2000Asher
SSU 2000is a high density plasma dry photoresist removal equipment, design for 4/6/8inch
wafer photoresist removal and ash processes. Use a high power plasma sources ystem,
it has performance advantages such as fast ash rate, good uniformity, low plasma damage, and low defects. Use for after photo process, PR Descum process,dry PR strip after ion implantation process, dry PR strip after etch process, and plasma cleaning surface treatment. This tool is design with single chambers, easily maintenance, stable performance,and low customer ownership and operating costs. Provide professional solutionsbased on different application process requirements of customers.
Equipment characteristics
Lowp lasma damage on the wafer surface;
Support regular thickness wafer and Taiko wafer PR strip
High PR ash rate, high production throughput, and long MTBC;
Tool's operate software developed based on Windows operation system, with friendly UI;
Product application
Wafersize: 4/6/8 inches compatible
Applicablematerials: photoresist, PI
Applicablefields: integrated circuits, power semiconductors, compound semiconductors
