SEC-300RIE Dielectric Etcher
SEC 300RIE is a reactive ion dry etch tool design with 8/12 inch wafer for dielectric layer dry etching
process, with high etch rate and good uniformity.The process type covers all dielectric etching in the front and back layer.This etch tool is designed with single chambers, Tool maintenance easily, stable performance, and low customer ownership and maintenance costs.
Equipment characteristics
High etch rate and good uniformity;
Single chambers, Tool maintenance easily,;
Etch tool's operate software developed based on Windows operation system, with a friendly UI ;
Product application
Wafer size: 8 /12inches
Applicable materials: OX, SiN, Poly,Si
Applicable processes: contact hole etch, passivation layer etch, hard mask etch, alignment mark etch, etc
Applicable fields: integrated circuits, power semiconductors, compound semiconductors, scientific research, etc
