SDU-3000Asher
SDU 3000 asher is a high density plasma dry photoresist removal equipment with EFEM, designfor 8/12 inch wafer photoresist removal and ash processes. Use a high power plasma source
system, it has performance advantages such as high ash rate, good uniformity, low plasma
damage on wafer surface, and low defects. Use for after photo process, PR Descum process, dry PR strip after ion implantation process, dry PR strip afteretching process, and plasma cleaning surface treatment. This tool is designed with dual chambers, high production throughput, easily maintenance, stable performance, and low customer ownership and operating costs. Provide
professional solutions based on the different application process requirements of customers.
Equipment characteristics
Low plasma damage on the wafer surface;
Supportregular thickness wafer and Taiko wafer PR strip
Fast PR ash rate, high production throughput, and long MTBC;
Etchtool's operate software developed based on Windows operation system, withfriendly UI;
Productapplication
Wafersize: 8/12 inches wafer
Applicablematerials: photoresist, PI
Applicablefields: integrated circuits, power semiconductors, compound semiconductors
