SVU-2000 Asher

SVU-2000 Asher

SVU 2000 Asher is a high density plasma dry PR strip chamber with a high vacuum transfer platform,   design for   PR strip and PR ash processes of 4/6/8-inch wafer.

Use a high power plasma source system, it has performance advantages such as high PR ash rate, good uniformity, small plasma damage on wafer surface, and low defects.Suitable for after wafer photoresist   process, PR Descum process, dry PR strip after ion implantation, dry PR strip after etching and plasma

cleaning. This tool is designed for a vacuum transfer platform with multi chamber cluster(supporting up to 6 process chambers), this ash tool with high production throughput,easily maintenance, stable   performance, and low customer ownership and maintenance costs. Provide professional plasma source   selection solutions basedon the different application process requirements of customers.

Equipment characteristics

Low plasma damage on the wafer surface;

High vacuum transfer platform for better particle control;

Supports PR strip of normal thickness wafers and Taiko thin wafer wafers;

High PR strip rate, high production throughput, and long MTBC;

Develop software based on Windows operate system, with a friendly UI interface;

Process application

Wafersize: 4/6/8 inches wafer

Applicable materials: photoresist, PI

Applicable fields: Integrated circuits, power semiconductors, compound semiconductors,scientific research, etc