SDU-2000Asher
SDU 2000is a high density plasma dry photoresist removal equipment, design for 4/6/8inch wafer photoresist removal and ash processes. Use a high power plasma sources ystem, it has performance advantages such as fast ash rate, good uniformity, low plasma damage, and low defects. Use for after photo process, PR Descum process,dry PR strip after ion implantation process, dry PR strip after etch process, and plasma cleaning surface treatment. This tool is design with twin chambers, high production throughput, easily maintenance, stable performance,and low customer ownership and operating costs. Provide professional solutionsbased on different application process requirements of customers.
Equipment characteristics
Lowplasma damage on the wafer surface;
Support regular thickness wafer and Taiko wafer PR strip
High PR ash rate, high production throughput, and long MTBC;
Tool's operate software developed based on Windows operation system, with friendly UI;
Product application
Wafersize: 4/6/8 inches compatible
Applicablematerials: photoresist, PI
Applicablefields: integrated circuits, power semiconductors, compound semiconductors
