SEC-200RIE Dielectric Etcher

SEC-200RIE Dielectric Etcher

SEC-200RIE is a reactive ion dry etch tool design with 4/6/8-inch wafer for dielectric layer dry etching process, with high etch rate and good uniformity.

The process type covers all dielectric etching in the front and back layer.

This etch tool is designed with multiple chambers, each chamber is independently controlled, and the

process is fully automatic and parallel.

Tool maintenance easily, stable performance, high production capacity, and low customer ownership

and maintenance costs.

Equipment characteristics

High etch rate and good uniformity;

Multi chamber design with high production capacity;

Etch tool's operate software developed based on Windows operation system, with a friendly UI ;

Product application

Wafer size: 4/6/8 inches

Applicable materials: OX, SiN, Poly

Applicable processes: contact hole etch, passivation layer etch, hard mask etch, alignment mark etch, etc

Applicable fields: integrated circuits, power semiconductors, compound semiconductors, scientific research, etc