The SEC 3000 series is specially designed for photoresist stripping and pretreatment in semiconductor wafer packaging. It adopts a fully automatic wafer handling system, independently controllable chambers, and diversified configurations to meet the needs of mass production.
Diversified configuration design that meets different process requirements
Compact modular design meeting requirements of high-capacity production
Features
Dual chamber design
Number of chambers customizable (up to six)
Separate control of each chamber
High-density plasma for fast photoresist removal
Lowest cost of ownership (COO)
Optional additional plasma technology
-Remote inductively coupled plasma (ICP)
-Remote microwave plasma
-Double plasma (microwave + radio frequency bias)
Windows-based industrial computer
EtherCAT-powered Ethernet control automation technology
Applications
Polymer stripping
Metal stripping
Mask material removal
Photoresist removal after high dose ion implantation
Photoresist removal for silicon carbide, gallium nitride, gallium arsenide, and indium phosphide production lines
Wafer surface pretreatment
