The SEC 3000 series is specially designed for photoresist stripping and pretreatment in semiconductor wafer packaging. It adopts a fully automatic wafer handling system, independently controllable chambers, and diversified configurations to meet the needs of mass production.

Diversified configuration design that meets different process requirements

Compact modular design meeting requirements of high-capacity production

Features

• Dual chamber design

• Number of chambers customizable (up to six)

• Separate control of each chamber

• High-density plasma for fast photoresist removal

• Lowest cost of ownership (COO)

• Optional additional plasma technology

     -Remote inductively coupled plasma (ICP)

     -Remote microwave plasma

     -Double plasma (microwave + radio frequency bias)

• Windows-based industrial computer

• EtherCAT-powered Ethernet control automation technology

Applications

• Polymer stripping

• Metal stripping

• Mask material removal

• Photoresist removal after high dose ion implantation

• Photoresist removal for silicon carbide, gallium nitride, gallium arsenide, and indium phosphide production lines

• Wafer surface pretreatment